Next-Generation Space AI Infrastructure

Modular
Thermal
Intelligence

OTIS packages thermal control, burst-power support, and radiation-aware fault handling into a unified integration layer — enabling more onboard AI without forcing a larger spacecraft bus.

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7
Integrated Subsystems
One stack replaces fragmented thermal, power, and compute layers
0g
Decorative Mass
Every kilogram carries structural, thermal, or electrical value
LEO
Primary Orbit
Designed for the harsh radiation and thermal cycling of low Earth orbit
AI
First Architecture
Infrastructure sized and scheduled around real inference workloads
The Problem

Space breaks
terrestrial assumptions

Terrestrial AI depends on convection, facility power, and tolerant infrastructure. In orbit, every assumption changes — and the systems that fail to adapt leave performance on the table.

Thermal Rejection

In vacuum, heat can only leave by radiation — not convection. Radiator area is scarce, spacecraft surfaces compete for solar collection and thermal rejection, and power is intermittent across eclipses.

Radiation Effects

Ionizing radiation and energetic particles flip bits, corrupt memory, degrade devices, and can trigger destructive overcurrent events — without a single visible crash, inference results quietly change.

Power Intermittency

Spacecraft batteries and regulators cannot absorb every AI burst peak directly. Oversizing the bus and battery for peak inference loads wastes mass that could fund additional capability.

Mass Budget Pressure

CubeSat and smallsat missions operate under tight kilogram constraints. Separate enclosures, coolers, and power regulators pile up dead mass — infrastructure that carries only one function per kilogram.

System Architecture

Every kilogram
earns its place

The OTIS modular stack co-locates structure, thermal transport, power conditioning, and supervisory control — so no component exists solely to support another.

OTIS Modular Stack-up — top to base
01 AI Compute Card NPU / FPGA / CPU + memory
02 Cold Plate + Vapor Spreader Direct-to-chip conductive path
03 PCM Burst Thermal Buffer Phase-change spike absorption
04 Embedded Flat Heat Pipes Passive heat transport to panel
05 Structural Radiator Panel Load path + thermal rejection
06 GaN PMAD + Supercap Bay Burst power + efficient conversion
07 Radiation-Aware Supervisor Fault detection, logging, recovery
Structural Radiator Principle

The radiator panel serves dual duty as primary structure, eliminating the need for a separate chassis. Surface coatings are optimized for low solar absorptivity and high IR emissivity to maximize passive heat rejection.

Phase-Change Thermal Buffering

Short AI inference bursts produce heat spikes that would otherwise force radiator oversizing. PCM tiles absorb transient peaks, allowing rejection hardware to be sized against realistic average loads rather than worst-case instantaneous demand.

Supercapacitor Burst Power

AI workloads are bursty by nature. A removable supercapacitor cartridge handles short high-current demands locally, smoothing the profile seen by the spacecraft battery and reducing peak bus stress.

Radiation Supervisory Layer

Rather than relying solely on rad-hard compute, OTIS implements watchdog monitoring, ECC memory paths, current limiting, staged power domains, and graceful recovery logic — enabling higher-performance commercial processors to operate credibly in orbit.

Core Capabilities

Built for the
orbital environment

01

Thermal Management

Integrated cold plate, vapor spreader, heat pipes, and structural radiator provide a short, low-resistance path from compute die to space-facing surface — no pumped loops, no external bulkheads.

02

Burst Power Support

GaN power management and supercapacitor cartridges buffer peak inference loads, reducing transient draw on the spacecraft bus and enabling sustained AI operation without battery oversizing.

03

Radiation Resilience

Supervisory logic detects SEU-induced errors, contains latch-up events through fast current limiting, and initiates recovery — from checkpoint restore to full-board reset — without ground intervention.

04

Onboard Inference

The AI compute card is mission-configurable — NPU, FPGA, CPU, or heterogeneous — enabling real-time data triage, autonomous decision-making, and low-latency inference without ground-loop latency.

05

Modular Integration

Standardized interfaces let customers adopt only the capabilities they need — from the base structural panel through compute support, burst-power module, and optional deployable radiator wing.

06

Power-Thermal Scheduling

Supervisory software decides when to run high-power inference, when to cap clocks, when to checkpoint, and when to defer lower-priority work — keeping the stack within thermal and electrical margins throughout the orbit.

Radiation Mitigation

Trustworthy inference
in a fault-prone environment

A radiation event may produce a silent memory error that changes an inference result without appearing catastrophic. OTIS addresses the full failure mode spectrum.

Effect Impact on AI OTIS Mitigation Layer
SEU — Single Event Upset Silent corruption of model parameters, intermediate calculations, or inference outputs ECC memory paths, watchdog validation, checkpoint restore, retry logic Compute
SEL — Single Event Latch-up Destructive overcurrent event capable of permanently damaging the processor Fast current limiting, staged power domains, supervisory disconnects, transient energy buffering Power
TID — Total Ionizing Dose Gradual performance degradation and reduced lifetime margin Thermal and power margining, health monitoring telemetry, modular compute card replacement System
DDD — Displacement Damage Altered semiconductor characteristics and changing sensor behavior over mission life Telemetry-driven derating, modular architecture enabling subsystem replacement without full redesign System
Product Family

Buy only the
capability you need

A shared base panel keeps integration simple. Optional modules unlock higher-burst, higher-rejection, or higher-resilience configurations as mission requirements evolve.

Foundation

Core Panel

Structure, radiator, and GaN PMAD in one flight-ready unit. The entry point for any OTIS integration.

  • Structural radiator panel
  • GaN power management
  • Standardized bus interface
  • Radiation supervisory firmware
Add-on Module

Compute Card

Mission-specific AI processor — NPU, FPGA, CPU, or heterogeneous — sized to the inference workload.

  • Customer or OTIS supplied
  • ECC-capable memory
  • Direct cold-plate interface
  • Watchdog integration
Add-on Module

Supercap Cartridge

Removable burst-power module for high-peak inference bursts without oversizing the spacecraft battery.

  • Plug-in supercapacitor array
  • Burst conditioning circuitry
  • Bus-transparent operation
  • Hot-swap capable design
Add-on Module

PCM Tile + Deployable Wing

Phase-change thermal buffer and optional deployable radiator interface for high-burst or high-average thermal missions.

  • PCM burst heat buffer
  • Deployable radiator interface
  • Expanded rejection area
  • Compatible with all core panels
Meet the Founders

Built by engineers
focused on orbital performance

OTIS is being built by founders working at the intersection of thermal systems, hardware integration, and next-generation compute infrastructure for space.

Co-Founder

Brady Cruse

Brady is a 3rd year undergrad studying Electrical Engineering at MIT. He specilizes in systems and materials engineering and is the current co-founder of two other succesfull startups.

Co-Founder

Daniel Cruse

Daniel is a 3rd year undergrad studying Aerospace Engineering at MIT.

Ready to run AI
in orbit?

OTIS works with satellite integrators, hosted-payload providers, and mission architects at the earliest stage of design. Reach out to begin a technical briefing.