OTIS is developing compact thermal infrastructure that enables higher-power orbital payloads within tighter spacecraft area, mass, and integration constraints.
As onboard processing grows, heat rejection increasingly determines payload capability, spacecraft size, and mission complexity.
Body-mounted radiator area is finite, while deployable systems add mechanisms, stowed volume, and structural burden.
More capable processors concentrate greater heat in smaller volumes, turning thermal capacity into a practical performance ceiling.
Thermal gains must justify their electrical power, mass, integration, and reliability costs at the spacecraft level.
OTIS is designed to increase useful thermal capacity while preserving the flexibility, integration simplicity, and resilience required by real spacecraft missions.
Increase payload capability without growing thermal hardware at the same rate as heat load.
Match thermal-system energy use to actual mission demand rather than operating permanently at peak conditions.
Extend from compact body-mounted capacity to larger modular and deployable rejection systems.
A modular thermal interface is designed to adapt across spacecraft sizes, payload classes, and mission profiles.
OTIS combines spacecraft engineering, thermal systems, and high-performance hardware integration.
Brady is a third-year MIT undergraduate studying electrical engineering, with a focus on systems and materials engineering. He has also co-founded two other startups.
Daniel is a third-year MIT undergraduate studying aerospace engineering, focused on spacecraft systems and the practical constraints of operating high-power payloads in orbit.
OTIS works with satellite integrators, hosted-payload providers, mission architects, and strategic partners. Qualified teams can request a confidential technical briefing.